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Materials Science and Engineering, University of Michigan

  MSE / People / Faculty / John Bilello

Denton Sputter System

Location: 1174 G. G. Brown

This 2500 Watt, direct current, planar magnetron sputter system is manufactured by Denton Vacuum, Inc. It is used by the Center for deposition of nanometer to micron scale coatings on a variety of substrates. The unit has dual 4 inch cathodes which allow for deposition in two different sputtering geometries, or for deposition of multilayer coatings.

The instrument is also coupled with the 18 kW Rigaku rotating anode x-ray generator. The system can be reconfigured and aligned to direct the x-ray radiation into the chamber for in-situ examination of structure and texture during growth.

Recent additions to the system include a hotstage capable of reaching up to 900°C for deposition onto heated substrates.

Double Crystal Diffraction Topography

Location: 2017 H.H. Dow Building

DCDT utilizes the change in peak spacing that comes with a bent Si wafer when it is placed into compression or tension by a film deposited onto its surface. Using a series of mathematical descriptions of this curvature, the interface stress can be calculated.

The strength of the DCDT system is that it measures curvature based on diffraction information from the single crystal substrate, rather than the physical curvature of the substrate. The technique can then be used on films which do not have a relective surface.

Instron 4204 Mechanical Testing Unit

Location: 2061 H H Dow Building

The Center has an Instron 4204 Mechanical Testing Unit available for testing of bulk materials.

Rigaku Rotating Anode X-ray System

Location: 1174 G. G. Brown

The 18 kW Rigaku rotating anode x-ray system is used for structure, texture, and stress analysis of CNS coatings. Two detectors are available for use with this system. First, a standard scinitillation counter is available for pole figure and structure analysis. However, an Inel Curvilinear Position Sensitive Detector (CPSD) is typically used in most applications. The CPS remains stationary during x-ray scans, but records the entire diffraction pattern simultaneously with one second time resolution. This speeds data collection, but also allows the x-ray system to be combined with the CNS sputter chamber to dynamically monitor texture and structure in-situ during PVD growth.

To perform structure analysis during PVD growth, the anode housing is rotated so that a secondary shutter is directed to precisely the correct location in the sputter chamber. Using a system of custom-fabricated beryllium components, the x-rays enter the chamber, diffract from the developing film, and exit the chamber through a second beryllium window. The CPS detector records the entire diffraction pattern in a matter of seconds, and is used to monitor structure and texture development throughout deposition of a film.

The Rigaku rotating Anode system is shown above, however, other images are shown in the Photo Album portion of this page.
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